In the field of high-speed optical communication, 400G/800G/1.6T modules, as core components of next-generation data centers and backbone networks, have extremely high requirements for reliability and bit error rate (BER). During the R&D, mass production testing, and verification stages of optical modules, BERT testing is required under different ambient temperatures to evaluate the module's performance stability in high-temperature, normal-temperature, and low-temperature environments. BlueGuard's TEC temperature control solution, with its advantages of high precision, fast response, bidirectional temperature control, and rapid customization, provides reliable high and low temperature environment simulation for optical module BERT testing. It significantly improves the accuracy and efficiency of optical module BERT testing, making it an ideal solution for temperature control systems in high-end optical communication test instruments.

In the aging test of optical lenses, the accuracy and stability of temperature control directly determine the reliability of product performance evaluation. Traditional heating methods are slow to respond, fluctuate greatly, and have uneven temperature differences, making it difficult to meet the aging verification requirements of high-end optical components, camera modules, and other products. This solution uses the BlueGuard TTD7008 TEC precision temperature controller as its core to build a high-precision temperature control system for optical lens aging testing. The entire line adopts a distributed network architecture, with a PC centrally managing 320 test positions, achieving automatic heating, temperature control, and cooling from room temperature to 80℃. The system's temperature control accuracy reaches ±0.1℃, supports multi-channel parallel processing, curve recording, and anomaly monitoring, providing a stable and efficient temperature control solution for the performance verification and reliability assessment of optical lenses.

Hot plate furnaces are key equipment used for pre-treatment baking of materials such as silicon wafers, gallium arsenide, and glass panels before applying adhesives. Their core function is to simultaneously and efficiently heat multiple components.